Electronic components industry news 2025-11-05

Long Xin storage LPDDR5X mass production: covering 12/16/24/32GB package scheme, with a speed of 8533/9600/10667Mbps, of which 10667Mbps is about 25% faster than the mainstream flagship standard; The ultra-thin package with a thickness of only 0.58mm is under study, which is beneficial to heat dissipation and terminal thinning. LPDDR5X comes standard for flagship mobile phones and is widely used in high-end notebooks, AI tablets and AR/VR. At the same time, the storage demand of AI server is about 8-10 times that of ordinary servers, which drives the storage industry into the upward cycle.
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Pusenmei completed hundreds of millions of A+ rounds of financing: jointly led by Qianhai Ark Fund and Shenzhen Venture Capital, with Guotai Junan Innovation Investment and Jin Peng Fund; The funds are used for R&D investment, capacity expansion and market expansion. Focusing on precision current sensing elements (CSR), the company has achieved the vertical integration of "upstream new materials-high-end equipment-components", and achieved breakthroughs in alloy material formula, electron beam welding equipment and microstructure technology, covering package alloys, thin film alloys, high-power shunts and modular products, with customers covering industrial control, new energy vehicles, photovoltaic energy storage, consumer electronics, robots, AI and so on.
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Aixin Yuanzhi released M57 vehicle chip and globalization strategy: with the concept of "all-dimensional security", it meets the global functional security and information security processes; It can be adapted to an 8-megapixel forward-looking all-in-one machine and compatible with a 2-megapixel camera, providing a cost-effective L2 driving scheme; It can support 5R5V integrated domain control upward, and realize 360 safety protection; Announce "release is application" and start the strategy of "localization, globalization, scale and high order"
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SK Hynix announces long-term roadmap: DDR6 is expected to debut in 2029-2031; In 2026-2028, HBM4/4E (the highest 16-layer stack) and AI-oriented LPDDR5X SoCAMM2, MRDIMM Gen2, LPDDR5R, CXL LPDDR 6-PIM are planned; In 2029-2031, the customized version of HBM5/5E and higher layer number and logic integration is planned, and at the same time, GDDR7-Next and PCIe 7.0 SSD, UFS 6.0, 400-layer above 400-layer 4D NAND and other route nodes appear.
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CPCA Show Plus 2025 focuses on localization of AI hardware: Jin Baize shows high-end PCB and system-level solutions for AI servers and humanoid robots, including 64-layer high-speed backboard, 26-layer AI computing board, 12-layer AI accelerator card, 0.035/0.05mm server-like carrier board with extreme line width and line spacing, and 16TOPS AI visual computing board; Through MSAP, laser micro-blind hole overlapping, mechanical disc hole, high-precision impedance and other special processes and "IPDM one-stop" service, the localization of key hardware will be helped.
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